TESCAN SOLARIS X – Xe Plasma FIB-SEM for Semiconductors

Ultimate resolution and maximum throughput in large-scale sample preparation and characterisation

An Xe Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis.

  • Key Features

    • NEW iFIB+™ Xe plasma FIB column - 2 μA probe current, fast and precise piezo-driven beam aperture change and gun alignment
    • Precise piezo-driven beam aperture changer - fast switching between FIB pre-sets using a strip with 30 FIB apertures for extended lifetime and minimum maintenance
    • Next generation Essence™ SW user interface - application-oriented, fully customisable and user-friendly layout
    • World's largest FIB and SEM Field of views - unmatched FIB Field of View: 1 mm at 30 keV
    • Smart and unique Triglav detection system - multi-detector system consisting of TriSE™ and TriBE™ enables collection of SE and BSE in the entire take-off angle range for maximum information of the sample
    • Smart and patented In-Flight Beam Tracing™ - adaptive spot shape optimisation for better performance at high currents
    • Enhancement of detection limits in ToF-SIMS analysis - no interference with the detection of other elements such as Ce, Ge and Ga

TESCAN SOLARIS X extends the capabilities of FIB physical failure analysis to large-area and deep cross-sectioning (up to 1 mm) of packaged microelectromechanical and optoelectronic devices, by combining the high-throughput i-FIB+™ Xe plasma FIB column with the next generation tripleobjective Triglav™ electron column.

Xe plasma FIB milling enables large-volume bulk material removal without the drawbacks of the traditionally used methods, which are often time-consuming, broadly destructive, dependent on operator skill, and can induce new heat/mechanical artifacts. Ion implantation and interaction ions. In addition, the inert nature of Xe ions prevents the formation of intermetallic compounds that can result in changes to the physical properties of the specimen and interfere with electrical measurements.

  • All
  • Additive Manufacturing
  • Automated Mineralogy
  • Biological Microscopy
  • Bioprinting
  • CL
  • CLEM
  • Computed Tomography
  • Computed Tomography - Life Sci
  • Diffraction Imaging
  • Digital Microscopy
  • EBSD
  • EDS
  • Electron Beam Lithography (EBL)
  • Electron Microscopy
  • Fabrication
  • FIB
  • Fluorescent Microscopy
  • Hyperspectral
  • In situ
  • Laser spectroscopy
  • LIBS
  • Light Microscopy
  • Micro XRF
  • Microscopy
  • Radiography
  • Raman
  • SEM
  • Spectroscopy
  • Super Resolution Microscopy
  • TEM
  • Thermal Probe Lithography
  • WDS
  • X-ray Imaging
  • X-ray Microscopy