FIB Stub 3.0

Simplified FIB lamellae preparation

Prepare lamellae directly on your Nano-chip inside your FIB

  • DENsolutions FIB Stub 3.0 Simplifies TEM Lamellae Prep

    Key Features

    • Ease of Use - both sample and chip are located on the same stub
    • Improved imaging - by removing shadows in the final polishing stage
    • Smart clamping - allows damage free installation of the chip and the sample on the stub
    • FIB safe geometry - minimising crash possibilities with the pole piece, GIS or the manipulator
    • Compatible with every FIB
  • FIB Lamellae Procedure Using FIB Stub 3.0

    A demonstration of how the simplified lamellae preparation process works with the new FIB Stub 3.0.

  • All
  • AFM/SPM/SNOM
  • CL
  • CLEM
  • Computed Tomography
  • EBSD
  • EDS
  • Electron Beam Lithography (EBL)
  • Electron Microscopy
  • Fabrication
  • FIB
  • In situ
  • Micro XRF
  • Microscopy
  • SEM
  • TEM
  • Thermal Probe Lithography
  • WDS
  • X-ray Imaging
  • X-ray Microscopy