Highest quality TEM lamella preparation and a superior analytical performance

Advanced nanofabrication system coupling UHR SEM column and best resolution Ga FIB column


    Key Features

    • Novel Orage™ Ga FIB column Ultra-high resolution Ga FIB column with excellent performance throughout the entire range of ion beam currents and full energy range down to 500 eV
    • Next generation Essence™ SW user interface Application-oriented, fully customisable and user-friendly layout
    • World's largest FIB and SEM Field of views Unmatched FIB Field of View: 1 mm at 30 keV
    • Smart and unique Triglav detection system Multi-detector system consisting of TriSE™ and TriBE™ enables collection of SE and BSE in the entire take-off angle range for maximum information of the sample
    • Smart and patented In-Flight Beam Tracing™ Adaptive spot shape optimisation for better performance at high currents
    • High FIB currents and SmartMill strategy Up to 100 nA for fast large-volume milling and SmartMill strategy slash by half the time for completing your cross-sectioning and lamellae lift-out processes
    • New single gas injection system OptiGIS Fast run up time and excellent stability of the deposition/etching rate. Up to 6 OptiGIS units are possible in one instrument
    • EquiPower™ lens technology Efficient thermal power dissipation and excellent electron column stability
  • All
  • CL
  • Diffraction Imaging
  • EBSD
  • EDS
  • Electron Beam Lithography (EBL)
  • Electron Microscopy
  • Fabrication
  • FIB
  • In situ
  • Microscopy
  • SEM
  • TEM
  • Thermal Probe Lithography
  • WDS