MIRA XR – Sub-nm FEG-SEM

Simplified UHR-SEM-EDS for rapid and precise materials analysis

Near real-time multiscale analysis

  • TESCAN MIRA XR - Sub-nm FEG-SEM

    Key Features

    • Sub-nm resolution
    • Super fast EDS analysis - Fully integrated Dual Essence EDS for routine EDS analysis
    • Easy imaging and analysis of challenging samples - Beam-sensitive, outgassing, oily, or degrading specimens
    • TESCAN's Wide Field Optics - For faster navigation and ROI identification
    • MultiVac - Quickly toggle between high and low vacuum
    • Easily automate workflows and customise experiments
    • Effortlessly switch between analytical and imaging settings in less than 10 seconds

TESCAN MIRA XR is a high-throughput, ultra-high-resolution SEM-EDS system designed for rapid and precise materials analysis in multi-user environments, such as academic research and quality control labs. With features like fully integrated Dual Essence™ EDS, Wide Field Optics™ and In-Flight™ Automation, you can generate ultra-high-resolution SEM data by at least 30% faster than conventional systems. This includes real-time elemental mapping with no shadowing artifacts

High levels of automation have removed including tedious tasks such as beam alignment and calibration ensure you spend more time imaging and produce repeatable results. TESCAN’s In-Flight Automation controls reduced focus, stigmation and beam alignment to one-click.

  • All
  • AFM/SPM/SNOM
  • CL
  • CLEM
  • EBSD
  • EDS
  • Electron Beam Lithography (EBL)
  • Electron Microscopy
  • Fabrication
  • FIB
  • Hyperspectral
  • In situ
  • Micro XRF
  • Microscopy
  • Raman
  • SEM
  • Spectroscopy
  • TEM
  • Thermal Probe Lithography
  • WDS