The TESCAN TEM AutoPrep Pro™ from TESCAN is an advanced, AI-driven solution for fully automated TEM sample preparation within a FIB-SEM environment. Suitavle for operators of any experience level, it has been designed to remove the complexity and variability of traditional workflows and enables users to reliably and repeatably produce high-quality, site-specific TEM lamellae with minimal operator intervention.

By combining intelligent feature recognition with automated milling, lift-out, and thinning, TEM AutoPrep Pro™ transforms a highly skilled, manual process into a streamlined and repeatable workflow. The result is consistent, high-yield sample preparation across a wide range of materials and applications.

Key Features & Benefits

  • Fully automated workflow – From trenching to final polishing with minimal user input
  • AI-driven feature recognition – Precise targeting of regions of interest
  • Reproducible lamella quality – Regardless of operator experience
  • Unattended operation – Enable overnight and multi-site batch preparation
  • Material-specific templates – Optimised recipes for metals, semiconductors, ceramics, and more
  • Integrated FIB-SEM control – Seamless operation within TESCAN systems
  • High throughput – Maximise instrument efficiency

Array of TEM samples prepared automatically in trench including all necessary steps such as electron beam and ion beam deposition of the protective layer, undercut and polishing steps including the low keV polishing step.

Brightfield STEM image of GaAs TEM sample prepared automatically using TESCAN AMBER X 2 plasma FIB, including automated polishing on the TEM grid including polishing at low
accelerating voltages.

Cross section TEM sample prepared from original TEM sample from Si prepared automatically by TEM AutoPrep Pro™ with a measured thickness down to 50 nm.

How AutoPrep Pro Works

TEM AutoPrep Pro™ automates the complete TEM sample preparation workflow directly inside a FIB-SEM system. It handles all critical steps—including coarse milling, lift-out, attachment, thinning, and final polishing—using pre-defined or customisable recipes.

Advanced automation ensures precise control of lamella thickness and geometry, while intelligent targeting enables accurate preparation from specific microstructural features. This drastically reduces the need for operator expertise and iterative trial-and-error.

Who is it Suitable For?

TEM AutoPrep Pro™ is ideal for:

  • Electron microscopy facilities seeking higher throughput and consistency
  • Materials science researchers working with complex or multi-phase materials
  • Semiconductor and failure analysis labs requiring precise, site-specific TEM samples
  • Multi-user environments catering for users with variable experience levels where ease-of-use and reproducibility are critical
  • Industrial R&D teams focused on efficiency, repeatability, and scalability

Benefits of Using  TEM AutoPrep Pro™

Traditionally, manual TEM sample preparation is time-consuming, skill-dependent, and often inconsistent. TEM AutoPrep Pro™ addresses these challenges by delivering a standardised, automated workflow that improves both efficiency and experimental outcomes.

By freeing up expert users from routine preparation tasks and enabling unattended operation, laboratories can significantly increase throughput while maintaining the highest standards of sample quality.

TESCAN FIB-SEMs