TESCAN have recently launched the MIRA XR, their latest ultra-high-resolution SEM-EDS solution designed for fast, precise materials analysis across industry and research. The MIRA XR bridges the gap between conventional FEG SEMs and UHR systems.
Key features of the new MIRA XR include:
- BrightBeam™ source for sub-nanometer imaging at low keV
- Dual Essence™ EDS for up to 50% faster elemental analysis
- Wide Field Optics™ for 40% faster navigation
- In-Flight™ Automation for simplified operation at all user levels
- MultiVac™ mode for beam-sensitive samples
This combination of features ensures you can generate ultra-high-resolution SEM data at least 30% faster than conventional systems. This includes real-time elemental mapping with no shadowing artifacts thanks to the Dual Essence EDS system.
High levels of automation have removed tedious tasks such as beam alignment and calibration enabling you to spend more time imaging and producing repeatable results. Similarly, TESCAN’s In-Flight Automation controls reduces focus, stigmation and beam alignment to one-click helping you to maximise your productivity.
With the ability to image down to image nanoscale structures with exceptional clarity while maximising time-to-data, the streamlined workflows will suit everyone who needs anything from routine imaging to advanced research. MIRA XR’s large, scalable chamber caters for various sample sizes and supports future upgrades, ensuring long-term adaptability.
Furthermore, MultiVac allows you to achieve high-vacuum-like imaging, even at low accelerating voltages on charging, outgassing and beam sensitive materials, making it a genuine all-rounder suited to multi-user facilities dealing with far-reaching sample types.
For more details on the MIRA XR, please visit the product page.