TESCAN SOLARIS X
EBSDEDSElectron Beam Lithography (EBL)Electron MicroscopyFabricationFIBMicroscopySEMTEMWDS
Solaris X
Xe plasma FIB-SEM for Semiconductors
Xe plasma FIB-SEM for Semiconductors
Rapid prototyping of nanostructures that can simultaneously produce and measure/image patterns and structures with nanosized geometries in a computer controlled environment and capable of 3D patterning, in situ inspection, markerless overlay and high resolution Closed-Loop Lithography (CLL) scanning
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Key Features
- Combined patterning and topography imaging with very high speed and accuracy. Using a design that combines high stiffness, zero mechanical friction and strongly reduced coupled motion to deliver superior positioning accuracy.
- 3D patterning and markerless overlay. Able to read topography with sub-nanometer sensitivity which does not lead to resist exposure. This removes the need for dedicated alignment marks which in turn removes difficulties associated with marker degradation and inconsistencies in the positioning hardware.
- Computer controlled environment. Humidity and temperature inside the Explore is computer monitored and the gas atmosphere is controlled using the NanoFrazor software. Gas supply can be connected from the laboratory or from a gas bottle that can be stored inside the tool’s gas control compartment.
- Direct laser writing (DLS) integration capable. The DLS option enables fast patterning of large features in the same resist layer that is nanostructured by the heated NanoFrazor tip.
- All
- CL
- CLEM
- EBSD
- EDS
- Electron Beam Lithography (EBL)
- Electron Microscopy
- Fabrication
- FIB
- In situ
- Micro XRF
- Microscopy
- SEM
- TEM
- Thermal Probe Lithography
- WDS
