The recent developments of new materials and manufacturing technologies are imposing new requirements for materials characterisation. Acquiring complete information about material microstructure and its relation to mechanical or physical properties often requires a multi-scale characterisation approach involving multiple analytical techniques.
TESCAN FIB-SEM solutions can combine high-resolution SEM imaging with a broad range of microanalytical techniques, including EDS, WDS, EBSD, Raman, or TOF-SIMS.
TESCAN is pioneering the Xe plasma FIB technology for enabling high throughput, large area ion milling of cross-sections, up to 1 mm, as well as routine milling and polishing operations for sample preparation. Since the Xe plasma FIB creates minimal damage of the sample structure and the inert nature of xenon ions means also that a contamination-free microsample preparation can be achieved, this all makes the Xe plasma FIB an ideal candidate for investigation of sensitive materials like aluminum or Li-ion batteries, without the risk of changing microstructural or mechanical properties.
The most recent technology meets in TESCAN AMBER X combining the field-free UHR-SEM optics with the Xe plasma focused ion beam (FIB) to provide high throughput, large area 2D cross sectioning and 3D multi-modal characterization capability for advanced materials research.
In this webinar, attendees will learn about:
- Challenges and innovations in focused ion beam technology in materials science
- Ga-free sample preparation examples using Xe plasma FIB-SEM
- Multi-modal approach for analyzing materials
- Basics of 3D microanalysis in FIB-SEM
- Application examples of using plasma FIB-SEM in materials science
